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TSL2671
DIGITAL PROXIMITY DETECTOR
TAOS118 ? JANUARY 2011
MANUFACTURING INFORMATION
The FN package has been tested and has demonstrated an ability to be reflow soldered to a PCB substrate.
The process, equipment, and materials used in these test are detailed below.
The solder reflow profile describes the expected maximum heat exposure of components during the solder
reflow process of product on a PCB. Temperature is measured on top of component. The components should
be limited to a maximum of three passes through this solder reflow profile.
Table 14. Solder Reflow Profile
PARAMETER
Average temperature gradient in preheating
Soak time
Time above 217 ° C (T1)
Time above 230 ° C (T2)
Time above T peak ?10 ° C (T3)
Peak temperature in reflow
Temperature gradient in cooling
REFERENCE
t soak
t 1
t 2
t 3
T peak
DEVICE
2.5 ° C/sec
2 to 3 minutes
Max 60 sec
Max 50 sec
Max 10 sec
260 ° C
Max ?5 ° C/sec
T peak
T 3
T 2
T 1
Time (sec)
t soak
Figure 19. Solder Reflow Profile Graph
t 3
t 2
t 1
Not to scale — for reference only
Copyright E 2011, TAOS Inc.
24
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www.taosinc.com
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The LUMENOLOGY r Company
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